Copper is the most extensively used material mostly in the electrical & electronics sectors due to its superior thermal, and electrical conducting, high reflectivity and malleable properties of other materials. Applications range from heat exchanges, electrical conducting circuits, radio frequency equipment, heat sinks etc. However, these fundamental properties also acted as roadblocks to the development of copper additive manufacturing. But over a period of time, these challenges are overcome due to advancements in technologies and the immense benefit offered by copper as an AM material. The copper AM technology could create highly complex geometries, which are impossible to get by conventional manufacturing technologies. Today, copper-printed heat sinks keep electronic systems cool, rocket nozzles send space crafts into space, and high-efficiency RF equipment & copper AM-printed electricity conducting coils enhance the motor output. Various copper AM technologies are available, such as FDM, SLM, binder jetting and cold spray. We’ll be discussing all these technologies in this article.

SLM (Selective laser sintering)

SLM is the powder-based 3D printing process in which the raw metal powder is melted by the application of a high-intensity laser and fused together layer by layer over a built platform to create an object. As the platform moves down a new layer of powder metal is spread across the platform for the creation of the next layer. The entire process repeats over again and again unravelling the whole object. Copper is difficult to print via this method due to its high thermal conductivity and reflectivity. A recent development by Germany-based AM machines maker Trumpf of the green laser led to the fabrication of copper parts overcoming the challenges due to copper properties. This critical development opens the doors to the cost-effective development of copper parts in less time. Post-processing includes wire cutting, heat treatment, manual support removal etc.